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1. product profile 1.1 general description general-purpose zener diodes in a sod323f (sc-90) very small and flat lead surface mounted device (smd) plastic package. 1.2 features ? total power dissipation: 310 mw ? tolerance series: b: approximately 5 %; b1, b2, b3: sequential, approximately 2% ? small plastic package suitable for surface mounted design ? wide working voltage range: nominal 2.4 v to 36 v 1.3 applications ? general regulation functions 1.4 quick reference data [1] pulse test: t p 300 s; ? 0.02 [2] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1cm 2 . pzuxb series single zener diodes in a sod323f package rev. 02 ? 15 november 2009 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit v f forward voltage i f =100ma [1] --1.1v p tot total power dissipation t amb 25 c [2] --310mw [3] --550mw
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 2 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package 2. pinning information [1] the marking bar indicates the cathode 3. ordering information [1] the series consists of 97 types with nom inal working voltages from 2.4 v to 36 v. 4. marking table 2. pinning pin description simplified outline symbol 1 cathode [1] 2 anode 2 1 sym06 8 2 1 table 3. ordering information type number package name description version pzu2.4b to pzu36b [1] sc-90 plastic surface mounted package; 2 leads sod323f table 4. marking codes type number marking code type number marking code b b1 b2 b3 b b1 b2 b3 pzu2.4 g3 - - - pzu10 gj fh hf kb pzu2.7 g4 f3 h1 - pzu11 gk fj hg kc pzu3.0 g5 f4 h2 - pzu12 gl fk hh kd pzu3.3 g6 f5 h3 - pzu13 gm fl hj ke pzu3.6 g7f6h4-pzu14 --hk- pzu3.9 g8 f7 h5 - pzu15 gn fm hl kf pzu4.3 g9 f8 h6 hs pzu16 gp fn hm kg pzu4.7 ga f9 h7 ht pzu18 gq fp hn kh pzu5.1 gb fa h8 hu pzu20 gr fq hp kj pzu5.6 gc fb h9 hv pzu22 gs fr hq kk pzu6.2 gd fc ha hw pzu24 gt fs hr kl pzu6.8 ge fd hb hx pzu27 gu - - - pzu7.5 gf fe hc hy pzu30 gv - - - pzu8.2 gg ff hd hz pzu33 gw - - - pzu9.1 gh fg he ka pzu36 gx - - -
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 3 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package 5. limiting values [1] t p =100 s; square wave; t j =25 c prior to surge [2] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1cm 2 . 6. thermal characteristics [1] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for cathode 1cm 2 . [3] soldering point of cathode tab 7. characteristics [1] pulse test: t p 300 s; ? 0.02 table 5. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit i f forward current - 200 ma i zsm non-repetitive peak reverse current - see table 8 and 9 p zsm non-repetitive peak reverse power dissipation [1] -40w p tot total power dissipation t amb 25 c [2] - 310 mw [3] - 550 mw t j junction temperature - 150 c t amb ambient temperature ? 65 +150 c t stg storage temperature ? 65 +150 c table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] --400k/w [2] --230k/w r th(j-sp) thermal resistance from junction to solder point [3] --55k/w table 7. characteristics t j =25 c unless otherwise specified symbol parameter conditions min typ max unit v f forward voltage i f =10ma [1] --0.9v i f =100ma [1] --1.1v
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 4 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package [1] f = 1 mhz; v r =0v [2] t p = 100 s; square wave; t j =25 c prior to surge table 8. characteristics per type; pzu2.4b to pzu5.6b3 t j =25 c unless otherwise specified pzu xxx sel working voltage v z (v); i z =5ma maximum differential resistance r dif ( ) reverse current i r ( a) temperature coefficient s z (mv/k); i z =5ma diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] min max i z =0.5ma i z =5ma max v r (v) typ max max 2.4 b 2.3 2.6 1000 100 50 1 ? 1.6 450 8 2.7 b 2.5 2.9 1000 100 20 1 ? 2.0 440 8 b1 2.5 2.75 b2 2.65 2.9 3.0 b 2.80 3.20 1000 95 10 1 ? 2.1 425 8 b1 2.80 3.05 b2 2.95 3.20 3.3 b 3.10 3.50 1000 95 5 1 ? 2.4 410 8 b1 3.10 3.35 b2 3.25 3.50 3.6 b 3.40 3.80 1000 90 5 1 ? 2.4 390 8 b1 3.40 3.65 b2 3.55 3.80 3.9 b 3.70 4.10 1000 90 3 1 ? 2.5 370 8 b1 3.70 3.97 b2 3.87 4.10 4.3 b 4.01 4.48 1000 90 3 1 ? 2.5 350 8 b1 4.01 4.21 b2 4.15 4.34 b3 4.28 4.48 4.7 b 4.42 4.90 800 80 2 1 ? 1.4 325 8 b1 4.42 4.61 b2 4.55 4.75 b3 4.69 4.90 5.1 b 4.84 5.37 250 60 2 1.5 0.3 300 5.5 b1 4.84 5.04 b2 4.98 5.20 b3 5.14 5.37 5.6 b 5.31 5.92 100 40 1 2.5 1.9 275 5.5 b1 5.31 5.55 b2 5.49 5.73 b3 5.67 5.92
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 5 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package table 9. characteristics per type; pzu6.2b to pzu36b t j =25 c unless otherwise specified pzu xxx sel working voltage v z (v); i z =5ma maximum differential resistance r dif ( ) reverse current i r (na) temperature coefficient s z (mv/k); i z =5ma diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] min max i z =0.5ma i z =5ma max v r (v) typ max max 6.2 b 5.86 6.53 80 30 500 3 2.7 250 5.5 b1 5.86 6.12 b2 6.06 6.33 b3 6.26 6.53 6.8 b 6.47 7.14 60 20 500 3.5 3.4 215 5.5 b1 6.47 6.73 b2 6.65 6.93 b3 6.86 7.14 7.5 b 7.06 7.84 60 10 500 4 4.0 170 3.5 b1 7.06 7.36 b2 7.28 7.60 b3 7.52 7.84 8.2 b 7.76 8.64 60 10 500 5 4.6 150 3.5 b1 7.76 8.10 b2 8.02 8.36 b3 8.28 8.64 9.1 b 8.56 9.55 60 10 500 6 5.5 120 3.5 b1 8.56 8.93 b2 8.85 9.23 b3 9.15 9.55 10 b 9.45 10.55 60 10 100 7 6.4 110 3.5 b1 9.45 9.87 b2 9.77 10.21 b3 10.11 10.55 11 b 10.44 11.56 60 10 100 8 7.4 108 3 b1 10.44 10.88 b2 10.76 11.22 b3 11.10 11.56 12 b 11.42 12.60 80 10 100 9 8.4 105 3 b1 11.42 11.90 b2 11.74 12.24 b3 12.08 12.60 13 b 12.47 13.96 80 10 100 10 9.4 103 2.5 b1 12.47 13.03 b2 12.91 13.49 b3 13.37 13.96 14 b2 13.70 14.30 80 10 100 11 10.4 101 2
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 6 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package [1] f = 1 mhz; v r =0v [2] t p = 100 s; square wave; t j =25 c prior to surge 15 b 13.84 15.52 80 15 50 11 11.4 99 2 b1 13.84 14.46 b2 14.34 14.98 b3 14.85 15.52 16 b 15.37 17.09 80 20 50 12 12.4 97 1.5 b1 15.37 16.01 b2 15.85 16.51 b3 16.35 17.09 18 b 16.94 19.03 80 20 50 13 14.4 93 1.5 b1 16.94 17.70 b2 17.56 18.35 b3 18.21 19.03 20 b 18.86 21.08 100 20 50 15 16.4 88 1.5 b1 18.86 19.70 b2 19.52 20.39 b3 20.21 21.08 22 b 20.88 23.17 100 25 50 17 18.4 84 1.3 b1 20.88 21.77 b2 21.54 22.47 b3 22.23 23.17 24 b 22.93 25.57 120 30 50 19 20.4 80 1.3 b1 22.93 23.96 b2 23.72 24.78 b3 24.54 25.57 27 b 25.1 28.9 150 40 50 21 23.4 73 1 30 b 28 32 200 40 50 23 26.6 66 1 33 b 31 35 250 40 50 25 29.7 60 0.9 36 b 34 38 300 60 50 27 33.0 59 0.8 table 9. characteristics per type; pzu6.2b to pzu36b ?continued t j =25 c unless otherwise specified pzu xxx sel working voltage v z (v); i z =5ma maximum differential resistance r dif ( ) reverse current i r (na) temperature coefficient s z (mv/k); i z =5ma diode capacitance c d (pf) [1] non-repetitive peak reverse current i zsm (a) [2] min max i z =0.5ma i z =5ma max v r (v) typ max max
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 7 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package t j =25 c pzu2.4b to pzu4.3b t j =25 c to 150 c fig 1. forward current as a function of forward voltage; typical values fig 2. temperature coefficient as a function of working current; typical values pzu4.7b to pzu12b t j =25 c to 150 c fr4 pcb, standard footprint fig 3. temperature coefficient as a function of working current; typical values fig 4. power derating curve v f (v) 0.6 1 0.8 mbg781 100 200 300 i f (ma) 0 060 0 ? 2 ? 3 ? 1 mgl273 20 40 i z (ma) s z (mv/k) 4.3 3.9 3.6 3.3 3.0 2.4 2.7 020 16 10 0 ? 5 5 mgl274 4812 i z (ma) s z (mv/k) 4.7 12 11 10 9.1 8.2 7.5 6.8 6.2 5.6 5.1 t amb ( c) 0 200 150 50 100 006aaa687 200 100 300 400 p tot (mw) 0
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 8 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package 8. package outline 9. packing information [1] for further information and the avai lability of packing methods, see section 14 . 10. soldering fig 5. package outline sod323f (sc-90) 04-09-13 dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 table 10. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 pzu2.4b to pzu36b sod323f 4 mm pitch, 8 mm tape and reel -115 -135 reflow soldering is the only recommended soldering method. dimensions in mm fig 6. reflow soldering footprint sod323f (sc-90) 001aab169 1.65 0.50 (2 ) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 9 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package 11. mounting pcb thickness = 1.6 mm pcb thickness = 1.6 mm fig 7. fr4 pcb, standard footprint fig 8. fr4 pcb, mounting pad for cathode 1cm 2 006aaa487 40 dimensions in mm 0.6 0.6 0.5 0.6 43.4 0.6 006aaa48 8 40 0.6 0.6 10 0.5 10 43.4 dimensions in mm
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 10 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package 12. revision history table 11. revision history document id release date data sheet status change notice supersedes pzuxb_ser_2 20091115 product data sheet - pzuxb_ser_1 modifications: ? this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content. pzuxb_ser_1 20060307 product data sheet - -
pzuxb_ser_2 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 02 ? 15 november 2009 11 of 12 nxp semiconductors pzuxb series single zener diodes in a sod323f package 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors d oes not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and condit ions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writ ing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
nxp semiconductors pzuxb series single zener diodes in a sod323f package ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 15 november 2009 document identifier: pzuxb_ser_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 9 packing information . . . . . . . . . . . . . . . . . . . . . 8 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 11 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 contact information. . . . . . . . . . . . . . . . . . . . . 11 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

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